3DS Platform 

3DS Platform
  • 3D Inertial System Platform (3DS) for packageless integration of MEMS IMU and electronics
  • Uses 3DTCVs to connect the MEMS and ASIC system chip at the wafer level
  • The CMOS wafer can be fully utilized with active devices since TSVs are not required
  • Capable of encompassing and integrating a variety of MEMS devices and IC technologies
  • “Smart Substrate” for 2.5D/3D integration of MEMS and electronics
  • True packageless System in a Chip
  • Lowest cost in the industry with elimination of bond wires and packaging; scalable

3DS Platform